- Water-based semi-permanent mold release agent.
- Designed for use with heated tools (250°F-350°F).
- For compression or resin transfer molding, vaccum infusion, or filament winding of epoxy, phenolic, and polyester resins.
- Water-based semi-permanent mold release agent.
- Designed for use with heated tools (250°F-350°F).
- For compression or resin transfer molding, vaccum infusion, or filament winding.
- Ideal for epoxy, phenolic, and polyester resins.
- Non-oily, non-staining, and chemically inert.
- Won't interfere with post-finishing operations.
- Comes pre-diluted.
- Available in different sizes to meet the needs of any facility.